Circuit Boards

“You Hold All The Cards”

S&K Electronics offers diverse methods of circuit card assembly (CCA) manufacturing to meet the requirements of your CCA products. These methods include:

  • Surface Mount Technology (SMT): Operation of two independent lines with a total capacity of 52,000 placements per hour. Components as large as 2.17" x 2.17" x 0.98"T and as small as 0.01" x 0.02" x 0.006"T (also known as 0201). BGAs and fine pitch components placed on a regular basis
  • Through-Hole Assembly: selective wave, wave soldering or with IPC-A-610 Level III trained assemblers in accordance with IPC-J-Std-001
  • Mixed Technology: support of a variety of products produced with a combination of SMT and Through-Hole technology
  • Flex circuit assemblies
  • RoHS (Restriction of Hazardous Substances) compliant processes available for all aspects of circuit card assembly: SMT, Through Hole and Hand Add, if needed
  • FPGA and EPROM programming available

Circuit Card Assemblies:

  • Conformal coating-urethane, acrylic and paraylene
  • ESD techniques per ANSI/ESD S20.20-1999
  • Workmanship in accordance with IPC-J-Std-001 and IPC-A-610 Level I, II and III
  • ICT with Hewlett-Packard HP3070 Series III
  • Hioki 1240 X-Y Flying Probe In-Circuit Tester
  • Flying probe with Huntron Protrack probing station
  • Testing capabilities from ICT to MDA
  • Manufacturing defect analyzer with Checksum MDA-TR8
  • Functional Tests developed by S&K Electronics engineering staff
  • Environmental stress screening (ESS)
  • All products 100% inspected and 100% tested