Circuit Boards
“You Hold All The Cards”
S&K Electronics offers diverse methods of circuit card assembly (CCA) manufacturing to meet the requirements of your CCA products. These methods include:
- Surface Mount Technology (SMT): Operation of two independent lines with a total capacity of 52,000 placements per hour. Components as large as 2.17" x 2.17" x 0.98"T and as small as 0.01" x 0.02" x 0.006"T (also known as 0201). BGAs and fine pitch components placed on a regular basis
- Through-Hole Assembly: selective wave, wave soldering or with IPC-A-610 Level III trained assemblers in accordance with IPC-J-Std-001
- Mixed Technology: support of a variety of products produced with a combination of SMT and Through-Hole technology
- Flex circuit assemblies
- RoHS (Restriction of Hazardous Substances) compliant processes available for all aspects of circuit card assembly: SMT, Through Hole and Hand Add, if needed
- FPGA and EPROM programming available
Circuit Card Assemblies:
- Conformal coating-urethane, acrylic and paraylene
- ESD techniques per ANSI/ESD S20.20-1999
- Workmanship in accordance with IPC-J-Std-001 and IPC-A-610 Level I, II and III
- ICT with Hewlett-Packard HP3070 Series III
- Flying probe with Huntron Protrack probing station
- Testing capabilities from ICT to MDA
- Manufacturing defect analyzer with Checksum MDA-TR8
- Functional Tests developed by S&K Electronics engineering staff
- Environmental stress screening (ESS)
- All products 100% inspected and 100% tested